Department: Hardware Engineering
Reports To: Hardware Engineering Manager / Lead Hardware Architect
Position Summary
The PCB Design Engineer is responsible for taking electrical schematics and developing high-performance, manufacturable printed circuit board layouts for complex electronic systems. This position works closely with hardware design, mechanical, thermal, and manufacturing teams to ensure designs balance electrical performance, signal integrity, physical constraints, and Design for Manufacturing (DFM) standards.
Key Responsibilities
Board Layout & Routing: Execute high-density, multi-layer (rigid, flex, and rigid-flex) PCB layouts, including high-speed digital, RF, mixed-signal, and high-power power delivery networks (PDN).
Signal & Power Integrity: Implement strict routing constraints for controlled impedance, differential pairs, length matching, crosstalk minimization, and ground plane stackups.
Symbol & Footprint Library Management: Create and maintain EDA component libraries, symbols, and land patterns following IPC standards (IPC-7351).
DFM / DFA / DFT Compliance: Apply Design for Manufacturability, Assembly, and Testability guidelines to ensure high production yield and seamless contract manufacturing.
Cross-Functional Integration: Collaborate with mechanical engineers to verify enclosure fit, connector placement, thermal dissipation, and 3D step-file exports.
Manufacturing Documentation: Generate complete fabrication and assembly packages, including Gerber files, ODB++, IPC-2581, drill charts, stackup diagrams, and Bill of Materials (BOM).
Engineering Support: Assist in early-stage component selection, schematic capture reviews, board bring-up, and design revisions via Engineering Change Orders (ECOs).
Qualifications & Requirements
Education: Bachelor’s degree in Electrical Engineering, Electronics Engineering, or equivalent practical experience.
Experience: 3–5+ years of dedicated PCB layout experience on complex, multi-layer printed circuit boards.
EDA Tool Proficiency: Mastery of major PCB design software suites (e.g., Altium Designer, Cadence Allegro / OrCAD, Siemens Xpedition, or Zuken CR-8000).
Technical Knowledge: Deep understanding of stackup design, high-speed routing techniques (DDR, PCIe, USB, Ethernet), split power planes, and EMI/EMC suppression strategies.
Industry Standards: Strong knowledge of IPC guidelines (IPC-2221, IPC-A-600/610, IPC-7351).
Preferred Qualifications
Experience with rigid-flex design and high-density interconnect (HDI) microvia technology.
CID (Certified Interconnect Designer) or CID+ certification.
Familiarity with thermal simulation, signal integrity (SI/PI) tools, and RF layout fundamentals.